Once an ingot has been grown it is then sliced up into wafers. In the case of the multicrystalline silicon, large slabs are grown which are then sliced up into smaller ingot blocks.
Large multicrystalline silicon block being sliced up into smaller bricks. The smaller bricks are then cut up into wafers with a wire saw.
Brick of multicrystalline silicon cut from slab and before being cut up into wafers.
Silicon brick being sliced up into wafers. Click on the picture to see the result at the end of the cutting process.